TELPOD’s original TFPR Power Chip resistors feature our thick film on alumina substrate technology for surge energy and overload applications. they provide the impulse energy capability normally associated with wirewound or composition resistors. These planar packages yield space saving, over 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level. TELPOD’s power resistors have a 130% higher operating temperature range than competitive product of similar design. Larger surface area and high efficiency of thick films mean that Surge Energy rating is up to 30% higher than competitor’s products. Refined design eliminating hot spots. Vertical mounting enhances board cooling due to natural convection airflow and minimises board area. Tinned copper leads are soldered on both sides in order to obtain a durable and stable connection.